Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison
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چکیده
منابع مشابه
Thermal Performance of an Elliptical Pin Fin Heat Sink
Christopher L. Chapman, and Seri Lee Aavid Engineering, Inc. Laconia, New Hampshire 03247 Bill L. Schmidt Silicon Graphics Computer Systems Mountainview, California 94039 Comparative thermal tests have been carried out using aluminum heat sinks made with extruded fin, cross-cut rectangular pins, and elliptical shaped pins in low air flow environments. The elliptical pin heat sink was designed t...
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Heat sinks are widely adopted in electronics cooling together with different technologies to enhance the cooling process. For the small electronics application, the small scale pin fins heat sinks are extensively used to dissipate heat in electronics devices. Due to the limit of space in the small devices, it is impossible to increase heat transfer area. In order to improve the heat transfer pe...
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This paper presents the comparative performance of several surrogate-assisted multiobjective evolutionary algorithms MOEAs for geometrical design of a pin-fin heat sink PFHS . The surrogate-assisted MOEAs are achieved by integrating multiobjective population-based incremental learning PBIL with a quadratic response surface model QRS , a radial-basis function RBF interpolation technique, and a K...
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Article history: Received 25 May 2015 Received in revised form 27 June 2015 Accepted 2 July 2015 Available online xxxx
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A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper heat sinks. Both the melting of the phase change material under a transient power spike input, as well as the resolidification process, are considered. Phase change materials of different kinds (paraffin ...
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ژورنال
عنوان ژورنال: International Journal of Heat and Mass Transfer
سال: 2018
ISSN: 0017-9310
DOI: 10.1016/j.ijheatmasstransfer.2017.10.065